2UUL Hand Finish Blades For Phone Screen Debonding / Removal IC, Model:Y
2UUL Hand Finish Blades For Phone Screen Debonding / Removal IC, Model:Y
In Stock.
Couldn't load pickup availability
Shipping Methods
Shipping Methods
To find out all available shipping methods, and the exact delivery time add the product to the cart, and verify it using our shipping calculator.
Order Processing Time
Order Processing Time
Handling time to dispatch order: 1 - 3 working days. (Onkiza has to process your order and put all your items through its strict quality-control tests.)
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.
DOA Guarantee
DOA Guarantee
If your item arrives damaged, please contact us within 7 days and provide clear and valid proof. Onkiza will make compensation based on the damage situation.
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. Onkiza will make compensation based on the damage situation.
2. The blade is from thin to thick, and the force is more uniform
3. It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc
4. Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield
5. Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm
Share
